With the rapid development of micro and nano electronic technology, thermal barriers caused by high integration chips, optoelectronic devices and systems have become the key bottleneck of its sustainable development. This kind of development bottleneck puts forward high requirements for advanced heat dissipation technology. Under such situation, the author first introduced the universal liquid metal cooling technology in the field of chip cooling around 2001, and then caused significant repercussions at home and abroad and a large number of follow-up research, which has become one of the most important development directions in this field in recent years. This move has a wide range of influence and is bringing disruptive changes to the development of energy, electronic information, advanced manufacturing, national defense, military and other fields, and will give birth to a series of strategic emerging industries. In order to promote the sustainable and healthy development of this new discipline, the author of this book systematically combs and summarizes its research results in the past 17-18 years, and compiles cost monograph. This book focuses on the new methods, new principles and typical applications of liquid metal heat dissipation technology, and basically covers all major topics in the field of liquid metal chip heat dissipation, including: basic thermophysical characteristics, flow characteristics, material compatibility, driving methods, heat transfer characteristics, microchannel heat dissipation technology, phase change thermal control technology and one As the first work in this field at home and abroad, it is an academic work with both theoretical and practical reference value. English version aims to promote the original scientific research achievements of China to the world.